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Leo P. Lambert
368 pp., illustrated, 1987
ISBN 0-8247-7681-X Marcel Dekker
The need for more densely populated printed wiring assemblies has produced significant technological advances in the areas of component interconnection. Rapid changes in component configurations and materials selection require the review and modification of traditional solderability testing procedures.
This invaluable reference covers the entire spectrum of electronic soldering, including preparations needed to perform quality work. It details basic soldering processes encountered during the printed wiring assembly manufacturing cycles.
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